Frivaldsky, M., Spanik, P., Morgos, J. and Glapa, N. (2018) “Optimized Thermal Simulation Model of Multilayer Printed Circuit Board ”, Communications - Scientific letters of the University of Zilina, 20(1), pp. 78-81. Available at: http://journals.uniza.sk/index.php/communications/article/view/50 (Accessed: 6April2026).